Board to Board Interconnect Board to Board Interconnect |


BeCeTM Board to Board Interconnect, comparable to soldered Connect but with benefits of a solder less socket.

High performance braided probes assures high test yields with lower test costs

 

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BeCeTM Unique Feature

Contact Force : 15 to 30g / Pin
Contact Resistance : 25 – 50 mΩ
Compliance : 15 – 25% Of Free Length
Durability : >100k
Temperature Range  : -45 – 180 °C
Pin Count : >5000 I/O
Fine Pitch : 0.4 mm & Above