BeCe^TM Board to Board Interconnect, comparable to soldered Connect but with benefits of a solder less socket.
High performance braided probes assures high test yields with lower test costs

 

BeCeTM Unique Feature Contact Force : 15 to 30g / Pin Contact Resistance : 25 – 50 mΩ Compliance : 15 – 25% Of Free Length Durability : >100k Temperature Range  : -45 – 180 °C Pin Count : >5000 I/O Fine Pitch : 0.4 mm & Above