BeCeTM Board to Board Interconnect, comparable to soldered Connect but with benefits of a solder less socket.
High performance braided probes assures high test yields with lower test costs
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BeCeTM Unique Feature
Contact Force |
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15 to 30g / Pin |
Contact Resistance |
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25 – 50 mΩ |
Compliance |
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15 – 25% Of Free Length |
Durability |
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>100k |
Temperature Range |
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-45 – 180 °C |
Pin Count |
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>5000 I/O |
Fine Pitch |
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0.4 mm & Above |
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