BeCeTM Burn-in Test Sockets are make of high grade ESD Engineering plastic and 6 series Aluminum body coated with ESD finishing to provide high strength with compact overall sizes.
High performance braided probes assures high test yields with lower test costs.
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BeCeTM Unique Feature
| Device Pitch |
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0.4mm & above |
| Signal Path |
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1.0mm |
| Contact Resistance |
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<40 mΩ |
| Self-Inductance |
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0.4nH |
| *For CSP, uBGA, DSP and LGA devices |
| *Pressure Mounting, no Soldering |
| *8 Points Tips Ensures Scrub on Solder Oxides |
| *Suitable For HTOL Burn-in-Test |
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